TestConX 2019 – Overview Rotate your smartphone to landscape or increase your browser width to see session descriptions.OverviewSundayMondayTuesdayWednesdayOverviewSunday March 3, 2019Optional Tutorial Beyond Sort, Burn-In, and Class Testing: Post Silicon Validation Hardware Strategy Welcome Reception & Dinner Invited Speaker Jan Vardaman,TechSearch International, Inc. Monday March 4, 2019Keynote Michael Campbell, Qualcomm Technical Sessions High Frequency, 5G, and millimeter-wave Validation 1 Advanced Packaging Validation 2 System Level Test Validation 3 Poster Session TestConX EXPO & Reception Tuesday March 5, 2019Distinguished Speaker Tawfik Arabi, Intel Technical Sessions Printed Circuit Board 1 Market Session Printed Circuit Board 2 Contact Technology Printed Circuit Board 3 TestConX EXPO TestConX Social Event Wednesday March 6, 2019 Technical Sessions ThermalOperations Awards Program subject to change without notice.OverviewSundayMondayTuesdayWednesday