TestConX 2023 – Tuesday

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Overview
Sunday
Monday
Tuesday
Wednesday
EXPO

Tuesday March 7, 2023

7:00 a

Continental Breakfast

Start the day right and enjoy the continental breakfast while networking with other attendees.

8:00 a

Market
Red Mountain Ballroom
Market

“Evolution of Semiconductor Technologies with New Applications Are Bringing A Bigger Stage for Test Suppliers”
Lin Fu
Yole Intelligence
John West
Yole Intelligence
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“Future of Test Connectivity Systems”
Panchami Phadke
TechInsights
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Session 5
Red Mountain Ballroom
Operations 1

“The Heterogeneous Road is Paved with Data”
Kenneth "Ken" Butler
Advantest
Keith Schaub
Advantest
Sonny Banwari
Advantest
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“Comparison of State-of-The-Art Models for Socket Pin Defect Detection”
Vijayakumar Thangamariappan
Advantest
Nidhi Agrawal
Advantest
Jason Kim
Advantest
Constantinos Xanthopoulos
Advantest
Ira Leventhal
Advantest
Ken Butler
Advantest
Joe Xiao
Essai
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10:00 a

Poster
Red Mountain Ballroom
Poster

“The deskewing technology for channel branching with fan-out buffers to implement a high parallelism probe card”
Yun-hyok Choi
Sungkyunkwan University
Byung-sung Kim
Sungkyunkwan University
Gyu-Yeol Kim
Samsung Electronics
Cheol-Heui Park
Samsung Electronics
Jaewoong Choi
Samsung Electronics
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“A Statistical Approach To Grouping Pins During Testing To Achieve Optimized Test Limits”
Deepak "Deepak M E" Musuwathi Ekanath
NXP Semiconductors
Matthew Crain
NXP Semiconductors
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“3D MEMS coaxial structure for 0.6 mm pitch high speed connector up to 60 GHz”
Tae Kyun "Steve" Kim
Microfriend
Yong Ho "YH" Cho
Microfriend
Jong Gwan Yook
Yonsei University
Joo Yong "JY" Kim
Microfriend
Sang Taek Oh
TLB Co., Ltd.
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“Review of Polymer Materials Utilized in Test Socket Applications with a Comparison of Key Material Properties”
Michael "Mike" Tustin
Ensinger
Louis Lau
Ensinger
Nami Lohbeck
Ensinger
Anton Schranner
Ensinger
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“High frequency High pin count test socket”
Hyung Jun "AJ" Park
IWIN
Sang Yang "Samuel" Pak
IWIN
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“High current carrying spring probe 30 Amps/pin”
Hyung Jun "AJ" Park
IWIN
Sang Yang "Samuel" Pak
IWIN
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11:00 a

Session 6
Red Mountain Ballroom
Operations 2

“Flexible Burn-in Sampling Plans”
Horst Lewitschnig
Infineon Technologies Austria AG
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“Design for Stress”
Joao Goncalves
Infineon
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“Portable Stimulus Test Development and Execution on ATE Systems”
Dave Armstrong
Advantest
Marcus Schulze Westenhorst
Advantest
Markus Buecker
Advantest
Klaus Dieter Hilliges
Advantest
Mate Burazin
Advantest
Mate Burazin
Advantest
Mate Burazin
Advantest
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12:30 p

Lunch

Lunch is served. Enjoy the break and networking time.

1:30 p

Session 7
Red Mountain Ballroom
Validation & Simulation

“Optimizing and Correlating a Spring Probe Contactor Electrical Performance Using RF Modeling”
James Hattis
Johnstech International
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“Full RF Characterization of Contactor Design on Load Board”
Aaren Lonks
Cohu
Nadia Steckler
Cohu
Jason Mroczkowski
Cohu
Noel Del Rio
NXP Semiconductor
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“Analysis of Test Socket Performance and Overall Equipment Effectiveness”
Lambert "Bert" Brost
Technoprobe
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“Using Encrypted HFSS models in HFSS to Determine System Performance”
Jeff Sherry
Johnstech International
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3:30 p

TestConX EXPO

Continue to explore the great exhibits at the TestConX EXPO. There is always something new to see or someone new to meet. Refreshments and drinks are served but don't spoil your appetite before the TestConX Social...

6:30 p

TestConX Social Event

Continue the networking with your colleagues and industry friends at the TestConX Social Event.

There will be lots of fun and great food in store!

9:00 p

Adjourn

Program subject to change without notice.

Overview
Sunday
Monday
Tuesday
Wednesday
EXPO