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Session 3 – Award Winning Performance
High performance devices call for high performance test and burn-in solutions and require participation by the entire test ecosystem including contactors, sockets, the DUT board, along with the environment that testing takes place in and the methodology applied. This session provides insight to each step beginning with the development of a statistical model to identify the optimized bandwidth for spring probes. Next up is a look at environmental factors that can readily impact socket performance and thus indirectly test yield. The third presentation verifies test methodology to troubleshoot a device that is having issues in a very high performance test contactor to determine the cause of the issues and affect changes to prevent them from reoccurring. Lastly, we’ll hear about the unique challenges to create an optimized test methodology for 25 to 40 GHz RF amplifiers, mixers, and down converters in LFCSP (QFN) and WLCSP packages, considering connectivity issues between DUT board and sockets."Design of Experiments Using Spring Probe Parameters for Optimized Socket Bandwidth"
Mike Fedde, Ila Pal
Ironwood Electronics
"Socket Performance vs. Environmental Conditions"
Gert Hohenwarter
GateWave Northern, Inc.
Presentation Download
"Troubleshooting Test Oscillation Problems"
Jeff Sherry
Johnstech International
"Optimization of Package, Socket, and PC board for 25 to 40GHz RF Devices"
Carol McCuen, Phil Warwick
R & D Circuits
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