Posters 2017

"Enabling Temperature Margining Solutions for Validating Automotive Electronics in Lab Automation Environment"
Ying Feng Pang
Hagai Wertheim
Rahima Mohammed
Amy Xia
Intel Corporation

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"Tool-less Thermal Tool Thermal Interface Material Holder and Package Pusher"
Nicky Strumtza
Intel Corporation

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"New Gimbaling Mechanism for Automated Test Systems"
Nicky Srumtza
Intel Corporation

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"Development of fan-out layer assembled 100um pitch BGA socket with 3D MEMS Technologies"
Sungho Kim
Eunkyung Lee
Sanghee Park
Jongmyeon Lee
Microfriend Inc.

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"Extremely short spring probe and socket body"
AJ Park
IWIN Co.,LTd.

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"Design method to endure the stress by high spring pin counts on the wafer test"
Shin-Ho Kang
Gyu-Yeol Kim
Sang-kyu Yoo
Samsung Electronics Company

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"Heat/Cold Resistant Dicing Tape for Frame Handling Final Test"
Eiji Hayashishita
Akimitsu Morimoto
Hideki Fukumoto
Mitsui Chemicals Tohcello, Inc.

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"Air Cooled Thermal Tool for System Level High Volume Manufacturing Testing"
Rahima Mohammed
Ridvan Sahan
Ying-feng Pang
Amy Xia
Hagai Wertheim
Intel Corporation

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"Elastomer Qualification Case Study for Extended Duration Contact Cycles"
Mike Dell
ISC
Emad Al-Momani
Intel

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"Universal adjustable docking for automated test equipment systems"
Jess Coleta
Willy Ganoy
ON Semiconductor Philippines

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"Design, Fabrication, and Characterization of Dense and Large-stand-Off Compressible MicroInterconnects (CMIs) for Advanced Testing and Socket System Application"
Paul Jo
Muneeb Zia
Joe Gonzalez
Muhannad Bakir
Georgia Institute of Technology

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"Low Cost / Low Profile Spring Probe"
Samuel Pak
IWIN Co., Ltd.

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"Embedded Thin Film NiP Resistors Relax Signal Integrity Constraints on Printed Circuit Boards Designed for High Speed"
Manuel Herrera
Ohmega Technologies, Inc.

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"WL Test Probe Continuous Improvement"
Jim Brandes
Xcerra

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"Introduction of Thermal Interface Material (TIM) in Thermal Management Solution"
HH Ng
TTS

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"Metallic Thermal Interface Material Selection for Burn-In"
David Saums
DS&A, LLC
Tim Jensen
Ron Hunadi
Carol Gowans
Bob Jarrett
Indium Corporation

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"Statistical Method for setting up Safe Screen Voltage for Products"
Krishna Mohan Chavali
Globalfoundries US Inc

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"Reliability Evaluation of Wing Riser Solder Joint used in Post Silicon Validation Environment"
Amy Xia
Ying-feng Pang
Jack Mumbo
Emad Al-Momani
Intel

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"A Case Study Evaluating the Performance of Carbon Nanotube Based Thermal Interface Materials in a Burn in and Test Application"
Craig E. Green
Leonardo Prinzi
Baratunde Cola
Carbice Nanotechnologies, Inc
Benoit Foisy
Yvan Cossette
IBM Bromont

Carbice Nanotechnologies, Inc

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