Welcome to BiTS

Fred Taber, IBM, BiTS General Chairman's Opening and Closing Remarks

2002welcome.pdf (881 KB)

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Sunday, March 3, 2002

8:00PM –  Invited Speaker

"The International Technology Roadmap For Semiconductors (ITRS) - Guidance for Global Technology and Manufacturing R&D Resources in the New Millenium "

Alan K. Allan, Staff Engineer
Intel Corporation

allan2002.pdf (1.02 MB)

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Monday, March 4, 2002

8:30AM – Socket Design Investigations

This opening session deals with investigations into several issues facing the socket engineer. You'll hear about recent work on contact material and reducing socket cost through design simplification.

• "Effect Of High Temperature Heating On Music Wire Spring Performance"
  
  Jiachun (Frank) Zhou, January Kister, Alberto M. Campos
  Kulicke & Soffa Interconnect, Inc.

• "Low Cost Burn-in Socket Design For Area Array Package (BGA)"
  Ichiro Fujishiro
  Yamaichi Electronics, USA Inc.

• "Force and Resistance Probing Automation for Contactors"
  Valts Treibergs,  Jason Mroczkowski
  Everett Charles Technologies

2002s1.pdf (2.2 MB)

10:30AM – Managing High Frequency Requirements

Socketing higher frequency devices, often in high volume, presents a host of challenging electrical and mechanical requirements to the socket/contactor engineer. This session's presenters share innovative work on designing, modeling and characterizing sockets/contactors for devices operating into the GHz frequencies.

• "Optimizing Load Board Design And Modeling For High Frequency Contactors"
  
  Jeff Sherry
  Johnstech International Corporation
  
• "The New YieldPro Array Series Contactor"
  
  Julius Botka
  Agilent Technologies

• "Electrical And Mechanical Performance Characterization Of High Frequency Test Sockets"
  Lisa Steckley, Dr. Hanyi Ding
  IBM Microelectronics

2002s2.pdf (1.76 MB)

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Tuesday, March 5, 2002

8:00AM – Thermal Management Methods

Controlling the temperature of today's higher power devices during test and burn-in operations has led to thermal management features becoming an integral feature in sockets. Learn about some procedures, methods & techniques to control device temperature.

• "Thermal Modeling Of Burn-in System"
  Liu Baomin
  Advanced Micro Devices

• "Burn-in System And Driver Board Technology Advances"
  Mike Niederhofer,  Bruce Simikowski
  Incal Technology, Inc.

2002s3.pdf (922 KB)

10:30AM – Burn-in Methodology

Trends in device complexity & circuit count, accelerating test & burn-in costs and advanced packaging are driving innovative approaches to the back-end-of-line processes. This session's presenters provide insight into alternative burn-in methodologies to deal with these trends.

• "Alternatives For Burning In Bare Die"
  Steve Steps
  Aehr Test Systems

• "Strip Burn-in For Fine Pitch Semiconductor Devices"
  Hon Lee Kon, Hongfei Yan
  Intel Corporation

• "High Performance Burn-in In Low Cost Environment"
  Tamas Kerekes -   ELES Semiconductor Equipment
  Giampiero Trupia - STMicroelectronics

2002s4.pdf (2.62 MB)

1:00PM –Modeling, Analysis, and Characterization

The session on the topics of Modeling, Analysis and Characterization has always been a hit at BiTS, and this year should be no exception. This four paper session discusses RF electrical measurements & modeling, contact force measurements and the relationship of contact resistance to insertions.

• "Electrical Modeling And Contactor Performance In A RF System"
  Jim Adley,  Eric Leung,  Jeff Sherry
  Johnstech International Corporation

• "Leaded 2mm Contactors: Measuring And Modeling To 10 GHz"
  Tom Strouth,  Orlando Bell,  Gary Otonari,  Eric Bogatin - GigaTest Labs
  Jeff Sherry - Johnstech International Corporation

• "Force Measurement On Sockets And Contactors"
  Richard Block,  Rafiq Hussain
  Advanced Micro Devices

2002s5.pdf (833 KB)

4:00PM – Burn-in Systems

Today's burn-in systems are required to handle devices with higher power and a range of sizes (often small), provide active thermal management, integrate with the socket's thermal management features and be cost effective. Several burn-in system approaches to address these needs will be discussed.

• "A Large Capacity And High Performance Burn-in And Test System For High Power Dissipating Components"
  Dr. Jerry Tustaniwskyj, Dr. James Babcock, Jim V. Rhodes
  Unisys Corporation
  
• "Burn-in Oven With Chilled Water Heat Exchanger"
  Chyi Feng Leow
  Trio-Tech International
  
• "The Challenges In Fine Pitch Burn-in Tooling"
  Hwan Ming Wang, Anthony Wong Yeh Ching
  Intel Corporation

2002s6.pdf (840 KB)

8:00PM – Keynote Speaker

"Tooling: The other ‘capital’ equipment"
Steven B. Strauss
ITTO Manager
Intel Corporation

2002kenote.pdf (3.52 MB)

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Wednesday, March 6, 2002

8:00AM – Burn-in Board Design

Another popular topic at BiTS. This year's session spaned a spectrum of burn-in board design topics, including contact pad plating considerations, optimizing and simulating decoupling and a discussion of the options for over-current protection.

• "Burn-in Board Over-current Protection – What Are The Options?"
  KW Low,  Zamel Jaafar
  Intel Corporation
  
• "Protecting Conductor Pads On Burn-in Boards From Oxidation And Corrosion"
  Alfred Sugarman, Al Loranger
  Loranger International Corporation
  
• "Power Decoupling Optimizer – A Systematic Frequency Domain Approach To BiB Noise Decoupling Simulation"
  
  Isaac Chang
  Intel Corporation

2002s7.pdf (452 KB)

10:30AM – New Products

Learn about some new socket products. The three papers in this session discuss a variety of challenges socket engineers face and offer unique solutions. We'' all watch closely to see if a candidate emerges for the 3rd annual "Almost Brilliant Disguise" award.

• "Kelvin Contacting Solutions For Leadless Device Types"
  Gerhard Gschwendtberger
  Multitest Elektronische Systeme GmbH
  
• "Interconnecting At 40 GHz and Beyond"
  Roger Weiss
  Paricon Technologies Corporation
  
• "Electro-chemical Cleaning Process"
  Erik Orwoll
  Nu Signal LLC

2002s8.pdf (1.76 MB)