TestConX China Call for Presentations

English

时间：2025年11月13日（周四）

地点：中国·上海虹桥 

诚邀您参加第11届电子测试技术研讨会TestConX  ChinaTestConX China，将于2025年11月13日（周四）以线下活动的形式在上海举办。届时将举行为期一天的技术主题演讲和一个TestConX Expo线下交流展，您将在那发现最新的测试技术、相关产品和解决方案。我们聚焦于电子行业的测试领域，提供从人员到解决方案的交流对接，千万别错过本届的行业盛会！

征稿启事

TestConX中国技术委员会诚邀业内优秀人士来稿，尤其是以下几点主题内容的挑战和解决方案相关演讲稿将获得高度关注：

  • 高性能计算（HPC）
  • 机器学习（ML）/人工智能（AI）专用处理器（ASP）
  • 图像传感器（如电动汽车、自动驾驶、人性机器人应用）
  • 移动设备（涉及细间距及堆叠封装PoP测试需求）

其他测试及老化相关主题征稿亦受欢迎（详见下文）。

演讲要求

  • 时长：30分钟/场（25分钟演讲+5分钟互动问答）
  • 语言：英语或普通话
  • 材料：仅需准备PPT（无需提交论文）
  • 摘要：提供250-500字原创技术摘要（原创或未曾发表的演讲）

         截止日期：2025年7月1日

 提交方式：在线填表 https://testconx.org/china-abstracts

邮件投稿：  [javascript protected email address]  （需包含标题、每一位参与作者的完整联系信息-作者姓名/所属机构或公司名称/职位/电子邮箱/电话号码/邮寄地址、现场演讲者姓名）

  • 结果通知：2025年7月18日左右
  • 终稿提交：2025年9月26日
  • PPT要求：使用TestConX模版（英语），可选中文版本。

本届论坛高度关注的测试应用领域：

  • HPC与ASP测试

针对ML/AI应用的高引脚数、细间距。

  • 图像传感器

电动汽车（含自动驾驶）及人形机器人应用。

  • 移动设备

细间距及堆叠封装（PoP）测试需求。

其他相关测试挑战主题（包括但不限于）：

封装测试中的电气与机械挑战话题--

  • 高频及高速数据率技术（如5G、毫米波）
  • 晶圆级封装（WLP）与板级加工（PLP）
  • 高电流、高功率、高温器件测试
  • 分选机（Handler）及转换套件设计考量
  • 细间距开尔文接触技术
  • 热管理与建模
  • 接触技术
  • 裸片（Bare Die）、系统级芯片（SoC）、系统级封装（SiP）及2/2.5/3D封装测试
  • 晶圆级芯片尺寸封装（WLCSP）测试（用于已知良品（KGD）或终测）

 

封装测试中的电气与机械挑战话题--

  • 空中下载（OtA）与封装天线（AiP）测试
  • 系统级测试（SLT）
  • 测试与老化产线运营
  • 插座修复、清洁与重镀方法
  • 大规模并行及非单颗测试（晶圆级/板级）
  • 缩短认证与生产时间的测试策略
  • 插座与PCB的验证、检测及认证
  • 条带测试（Strip Testing）与托盘测试（Test-in-Tray）
  • 高可靠性测试（关键任务及医疗应用）
  • 微机电系统（MEMS）及非电学（光学、流体、磁学、声学等）激励测试
  • 测试启动、特性分析与验证
  • 云与大数据分析
  • 可测试性设计（含ATE测试、SLT及可靠性测试）
  • 失效分析

 

模块与产品测试挑战话题--

  • 夹具与测试接触
  • 测试自动化
  • 自动化物料处理
  • 大规模无线测试
  • 温度控制

 

PCB设计与制造挑战话题--

  • 高温老化测试板应用
  • 高速数据率测试应用
  • 空间转换器及超细间距负载板/探针卡设计
  • 板间互连技术
Call for Presentations and Posters for
TestConX China 2025
Hongqiao, Shanghai November 13, 2025

Join us for the 11th annual TestConX China workshop to be held in-person on November 13, 2025. There will be a full day of technical presentation and a TestConX EXPO where you will find the latest in test products and solutions. Don’t miss the preeminent China event focused on connecting electronic test professionals to solutions.

The TestConX China Technical Program Committee is seeking presentations that highlight the challenges and solutions for high performance computing (HPC) and application specific processors (APC) for machine learning (ML) / artificial intelligence (AI); image sensors; and mobile devices. Other proposals on a broad range of test and burn-in topics, as illustrated below, are also highly valued.

Each presentation at TestConX China is provided a thirty-minute presentation slot (approximately 25 minutes for the presentation with 5 minutes for questions and answers). Authors may choose to present in English or Mandarin. And authors only need to prepare a PowerPoint presentation. (There is no paper to write.)

Please submit a 250-to-500-word abstract for presentations of your original, previously unpublished,
technical presentation by July 1, 2025. 

Submit via:

or 

  • Email [javascript protected email address] including title of presentation, complete contact information (name, affiliation/company name, job title, email address, phone number, and mailing address) for each author, and name of presenter.

Abstracts will be reviewed and authors will be notified around July 18, 2025.
Presentation submissions are due September 26, 2025.

Language:  Presentation in English or Mandarin. PowerPoint slides in English with the option to also create Chinese slides.

Test applications of highest interest include:

  • High Performance Computing (HPC) and Application Specific Processors (ASP) for Machine Learning & Artificial Intelligence (AI) applications driving high-pin count fine-pitch high-powered test requirements.
  • Image sensors for electric vehicles including autonomous driving and humanoid (robotic) applications.
  • Mobile devices with fine-pitch and package-on-package (PoP) test requirements.

 

Topics that address the challenges of these and other test applications include, but are not limited to:

 

Electrical & Mechanical Challenges in package testing

  • High frequency and high data rate techniques and technologies including 5G and mm-wave
  • Wafer Level Packages (WLP) and Panel Level Processing (PLP)
  • High current, high power, and/or high temperature device testing
  • Handler & change kit designs and considerations
  • Fine Pitch Kelvin Contacting
  • Thermal management and modelling
  • Contact technology
  • Bare Die, system on a chip (SOC), system-in-package (SiP), and 2/2.5/3D package testing
  • Wafer level chip scale (WLCSP) test for Known Good Die (KGD) or final test

 

Test Process & Operational Challenges 

  • Over the Air (OtA) and Antenna in Package (AiP) testing
  • System Level Test (SLT)
  • Test & Burn-in floor operations
  • Socket repair, cleaning, and re-plating methods
  • Massively parallel and non-singulated test (Wafer Level and Panel Level)
  • Test strategies for reducing qualification and production time
  • Socket & PCB verification, checkout, & qualification
  • Strip Testing and Test-in-Tray
  • High reliability testing for mission critical and medical applications
  • Microelectromechanical system (MEMS) and non-electrical (optical, fluidic, magnetic, acoustic, etc.) stimuli testing
  • Bring-up, characterization, and validation
  • Cloud and big-data analytics
  • Design for testability including ATE test, SLT, and reliability test
  • Failure analysis

 

Module & Product Test Challenges

  • Fixturing and test contact
  • Test automation
  • Automated material handling
  • Wireless testing at scale / high volume
  • Thermal control

 

Printed Circuit Board (PCB) Design & Manufacturing Challenges 

  • For high temperature Burn-in board applications
  • High data rate test applications
  • Space Transformers and Ultra-fine pitch for load boards and probe cards
  • Board to Board Interconnects