Session 1 - Market Report
- Keynote - Advanced Packaging Innovation Challenges - Super-thin Optical SiP & CIS
- Keynote - Large Panel Fan-Out (LPFO) Technology Overview and Development
- Market Place Report - Strong Global Demand for Semiconductors Brings Unlimited Opportunities in China
Session 2 - 5G and mm-wave Test Challenges
- RF Module Test Challenges
- Over the Air Test for Antenna in Package IC
- Feasibility Evaluation of a Spring Pin Wafer Probing Approach for a 5G WLCSP Application
Session 3 - High Frequency and High Current
- Interpretation and Application of Test Contactor Specification
- One Type Wiping Contact Introduction
- Contact Probe CCC Study and Application