"RF Module Test Challenges"
"射频模组的测试挑战"
Keith Schaub
Advantest
Roger McAleenan
Advantest
Ira Leventhal
Advantest
"Suzhou"
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"Shenzhen"
"Over the Air Test for Antenna in Package IC"
"片上级天线封装芯片的无线测试"
Dongmei Han
Xcerra
"Suzhou"
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"Shenzhen"
"Feasibility Evaluation of a Spring Pin Wafer Probing Approach for a 5G WLCSP Application"
"弹簧探针在5G晶元级别的测试应用可行性研究"
Jose Moreira
Advantest
Krzysztof Dabrowiecki
Feinmetall
Paul Hurst
Harbor Electronics
Thomas Gneiting
Admos
Ali Abdallah
Admos
"Suzhou"
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"Shenzhen"
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