"Advanced Packaging Innovation Challenges - Super-thin Optical SiP & CIS"
"先进的封装创新所面临的挑战 – 超薄光学SiP和CIS"
"先进的封装创新所面临的挑战 – 超薄光学SiP和CIS"
Mark Huang
CTO & VP
A-kelon (Huizhou) Optronics
"Large Panel Fan-Out (LPFO) Technology Overview and Development"
"大板扇出技术综述及研发"
"大板扇出技术综述及研发"
Tingyu Lin
Technical Director
National Centre for Advanced Packaging (NCAP)
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