"Modeling Socket Thermal Performance Inside a Burn-In Chamber"
Jason Cullen
Plastronics
Rob Caldwell
Delta V Instruments
"Established the first WLCSP Testing at Tri-temp for RF and Non-RF Products"
Edwin Valderama
Jin Sheng Tan
Intel Technologies
"A Silicon Photonics Wafer Probing Test Cell"
Roberto Aranzulla, Daniele Sala, Roberto Barbon - ST Microelectronics
Giuseppe Astone, Maurizio Rigamonti, Massimo Galli - ST Microelectronics
Jean Luc Jeanneau, Dario Adorni, Paul Mooney - Tokyo Electron
Hubert Werkmann, Fabio Pizza - Advantest Europe GmbH
Jose Moreira, Zhan Zhang - Advantest
Return to the 2016 BiTS Workshop Archive index page