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Session 4 – The Market is Open
The BiTS Workshop just wouldn't be the BiTS Workshop without at least one presentation on the test and burn-in marketplace. In this year's three presentations, first we'll hear about the technical and market forces that are shaping the future of test and burn-in, particularly the challenges of industry cycles with the never ending quest for reduced costs. Next up will be our own Fred Taber, with his fourth annual Socket Report on the size of the market, whether its shrinking or growing, and companies that are leading the charge. This session's final paper hones in on a market technology trend with one innovative high-density package-on-package (PoP) solution requiring test hardware to accommodate fine pitch wire-tip interconnects. Socket and test hardware development and verification studies are underway to take this technology to high volume manufacturing."The Technical and Market Forces Shaping the Future of Test and Burn-In Sockets"
John West
VLSI Research, Inc.
"Socket Marketplace Report"
Fred Taber
Taber Consulting
"Manufacturing Readiness of Bond Via Array (BVA™) Technology for Fine-Pitch Package-on-Package (PoP)"
Rajesh Katkar, Rey Co, Wael Zohni
Invensas
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