Invited Speaker – Jan Vardaman

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Invited Speaker – Jan Vardaman

Wireless products continue to drive the unit volume growth in semiconductor packaging today. Growth in wafer level packages (WLPs) continues to be driven by the strong preference for small form factor, low profile packages for use in mobile phones. WLPs with a variety of pin counts and die sizes are also found in watches, MP3 players, digital cameras, laptops and tablets. Pin counts are increasing and ball pitch is decreasing. New WLP formats are emerging. Fan-out WLPs (FO-WLPs) are receiving increased interest for more than just single die package and are emerging as a new potential format for SiP. This presentation examines application trends for WLPs, trends in pin count, die size, and ball pitch, as well as new package formats.

"Trends in Wafer Level Packaging: Thin is In!"
E. Jan Vardaman
President & Founder
TechSearch International, Inc.

Mrs. E. Jan Vardaman is president and founder of TechSearch International, Inc., which has provided licensing and consulting services in semiconductor packaging since 1987. She is the co-author of How to Make IC Packages (published in Japanese by Nikkan Kogyo Shinbunsha), a columnist with Circuits Assembly/Printed Circuit Board Fabrication, and the author of numerous publications on emerging trends in semiconductor packaging and assembly. She is a member of IEEE CPMT, SMTA, MEPTEC, IPC, IMAPS and SEMI. She was elected to two terms on the IEEE CPMT Board of Governors. Before founding TechSearch International, she served on the corporate staff of Microelectronics and Computer Technology Corporation (MCC), the electronics industry’s first pre-competitive research consortium. She has made numerous presentations on developments in advanced packaging.

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