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Session 4 – Bring it to the Board (PCB) & Market Report
The device under test (DUT) board is sometimes overlooked as a critical element in test-and burn-in strategies. This session brings PCBs into the limelight. The first presentation will cover some of the challenges that various DUT layouts present, demonstrating to semiconductor and ASICS design engineers the importance of considering final test hardware when designing device layouts. Another important consideration, covered in the second presentation, is the importance of performing RF characterization and simulation in-house to accurately measure the materials’ electrical performance.As a bonus in this session, you’ll get a look at the marketplace for test equipment and test consumables.
"Building Optimized Test PCB’s Starts at the DUT"
Joe Birtola
CMR Summit Technologies
"High Frequency PCB Material Characterization and Simulation"
Ryan Satrom
Multitest
Market Report
"Market Trends in Test Equipment and Test Consumables"
John West
VLSI Research
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