Introducing…BiTS Tutorial

BiTS is pleased to announce that world renowned high frequency expert Eric Bogatin presented a special half- day tutorial. 

“Signal Integrity and Test Sockets- simplified”

The electrical properties of sockets have always been important, but never more so as application bandwidths exceed 2 GHz for RF and high speed digital devices.  Yet, there are many aspects of socket characterization, analysis and design, which are confusing and sometimes, even misleading. In this tutorial, Eric will dispel some of the myths and misconceptions on this topic and review the basics of what a socket designer or user needs to know to evaluate a test socket for high-speed applications.

The Tutorial handout slides can be downloaded below:

bits2005_tutorial_bogatin.pdf ( 1.25 MB)

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Welcome and Wrap-Up to BiTS 2005

Fred Taber, IBM, BiTS General Chairman's Opening 7 Closing Remarks

2005_welcome_wrapup.pdf (168 KB)

PANEL DISCUSSION

Topic:  "Thermal Issues Related to Devices of Today and Tomorrow, What Can We Expect Moving Forward?"

Preface:  A panel comprised of end user and supplier representatives discussed challenges and possible solutions to achieve thermal control of devices in burn-in and test. Several factors make this a critical topic in today's environment:

• Market demand for higher power devices

• Smaller devices and increased functionality

• Shrinking device feature size contributing to thermal differences from chip to chip on a wafer

• Thermal management to achieve effective/accurate test and burn-in

Panel Members:

SESSION 1 - MAKING BETTER CONTACT
Today’s demanding conditions make achieving and maintaining good contact a challenge. This opening session's presenters discuss their work on materials, lead-free and cleaning to overcome contacting hurdles.

Enhanced High Strength/High Conductivity Copper-Beryllium Strip For Demanding BiTS Applications	John Harkness, Brush Wellman
Challenges Of Contacting Lead-Free Devices	Brian Sheposh, Johnstech
Application Of Socket Cleaning And Contact Restoration To Reduce Burn-In, Test And Device Programming Cost	Erik Orwoll, Nu Signal Jason Hughes, IBM Microelectronics

2005s1.pdf (1.53 MB)

SESSION 2 - SOCKET DESIGN ADVANCEMENTS
Technical requirements and cost reduction are driving this session’s speakers to introduce novel ideas in socket design. You’ll hear about recent work on Kelvin sockets and socket standardization that led to successful introduction to manufacturing.

2005s2.pdf (6.84 MB)

SESSION 3 - PRINTED CIRCUIT BOARD DESIGN
Always a popular topic at BiTS, this year’s session on Printed Circuit Boards addresses several prominent and increasingly complex considerations and requirements faced by the board designer and manufacturer, such as fine pitch, high power and signal integrity.

2005s3.pdf (3.67 MB)

SESSION 4 - OPTIMIZING HIGH FREQUENCY PERFORMANCE
Higher bandwidth devices require more focus on the socket’s electrical characteristics. Our presenters cover common metrics and tools utilized to improve electrical performance, plus share some measurement and modeling case studies.

2005s4.pdf (1.37 MB)

SESSION 5 - CHARACTERIZATION AND QUALIFICATION
This topic has always been one of the most popular at BiTS and this year should be no exception. With discussions relevant to today’s high stakes decisions, hear about the quantitative and qualitative processes followed by our speakers from the user and supplier communities.

2005s5.pdf (3.13 MB)

SESSION 6 - TEST AND BURN-IN OPERATIONS
This session’s presenters take us through innovative approaches, techniques and methodologies to achieve lower cost, improve manufacturing operations/processes and effectively handle the massive amounts of data produced by the manufacturing process.

2005s6.pdf (8.15 MB)

Hot Topics Session - CONTROLLING ESD
Still have those ESD issues that surfaced at BiTS 2004? Well, we’ve arranged for a special bonus session on this hot topic.  You’ll learn about an ESD controlled socket and new materials to control ESD.

2005ht.pdf (489 kB)

KEYNOTE ADDRESS

"PACKAGING TRENDS AND THE IMPACT OF MODULE TEST"

Eric Tosaya - Advanced Micro Devices

A review of packaging trends for microprocessors was presented that will covered the types of packaging used by major suppliers for different market segments such as server, desktop, mobile, handheld, etc. The various key driving forces for the types of packages selected for each market segment was summarized. Then the processor backend of line (BEOL) manufacturing flow was presented and the manufacturing and technical challenges presented by the various BEOL test operations was discussed.

2005_keynote.pdf (609 kB)

SESSION 7 - THERMAL MANAGEMENT
Temperature control during test and burn-in is a common but critical requirement, yet achieving it is complex.  Our three presenters took away some of the mystery by sharing their thermal management methods and techniques for devices across a wide power range.

Thermal Characterization and Specification For Test And Burn In	Dave Gardell, IBM Microelectronics
A Cost Effective, Flexible Approach To Automated Thermal Control During Burn-In	Chris Lopez, Wells-CTI Brian Denheyer, Wells-CTI Mike Noel, Freescale Don VanOverloop, Freescale
Highly Efficient Passive Heatsinks For 5-20 Watt Applications	Natarajan "Ram" Ramanan, Ph.D., P.E., Applied Thermal Technologies Mike Ramsey,  Plastronics

2005s7.pdf (2.02 MB)

SESSION 8 - MANAGING FINE PITCH
As pitch gets ever tighter, there are smaller tolerances available to successfully socket a device. Key issues of alignment and contact type/size/
shape/characteristics, along with proposed solutions, are covered by this session’s three presenters.

2005s8.pdf (2.99 MB)

SPECIAL BONUS SESSION - SUPPLEMENTAL PAPER
The topic is high current characterization - a 'hot' topic from BiTS 2004! 

2005s.pdf (580 KB)