Limited copies of bound BiTS Workshop 2004 Proceedings are still available for a nominal fee (plus shipping and handling), shipped anywhere in the world! Please call the BiTS office in the USA at (845) 226-7560 or by email for details.  

Welcome to BiTS 2004

Fred Taber, IBM, BiTS General Chairman's Opening Remarks

2004welcome.pdf (168 KB)

Sunday, March 7, 2004

8:00 PM – PANEL DISCUSSION   

The technical program begins after dinner with a panel of experts briefly sharing their thoughts and experiences on a topic of current interest to the socket community. Then it's the audience's turn to engage and challenge the panel with some questions, comments and perhaps some debate. 

TOPIC:  MAKING IT ALL WORK TOGETHER: INTERFACE CHALLENGES AND SOLUTIONS

A panel comprised of end user and supplier representatives will discuss interfacing challenges and possible solutions to achieve a successful integration of the load board, change kit/nest, docking hardware, handler, contactor, test head, and the package to meet the end customer's requirements. End user panelists include leading semiconductor manufacturers and supplier panelists include load board, handler, contactor/socket and test system suppliers.

PRE-PANEL PRESENTATION

"Obstacles In The Transfer Of Contactor Solutions From The OEM To The Subcontractor"
Jon Diller - Synergetix

2004prepanel.pdf (61 KB)

PANELISTS

Monday, March 8, 2004

Session 1 -  PUSHING THE ENVELOPE

It's challenging out there! This opening session's presenters discussed some new technology solutions, key drivers and operations breakthroughs that press against the boundaries of today's know-how and practices.

• "IC Power - The Influence and Impact of Semiconductor Technology"
  Marc D. Knox
  IBM Corporation

• "Reducing the Cost of Test in Burn-in, an Integrated Approach"
  Mike Noel, Don VanOverloop, Allan Dobbin
  Motorola Semiconductor Products Sector

• "0.4mm BGA Burn-in Socket in Compression Mount, Another Breakthrough in Socket Technology"
  Helge Puhlmann, Kazuhiro Matsuda, Jec Sangalang
  Yamaichi Electronics

2004s1.pdf (2.13 MB)

Session 2 -  THERMAL ANALYSIS

Thermal management provisions are now a commonplace feature in sockets/systems, yet with device power continuing to grow, ever more complex analysis is needed to arrive at technologies to dissipate more heat. Our presenters shared their thermal modeling and analysis work on a number of these techniques.

• "FEA Analysis of a Burn-in Socket Contact - Beware the Use of Simple Models"
  Dr. James A. Forster, Prasanth Ambady, Ray Mandeville 
  Texas Instruments

• "Chips On Fire, New Approach To Thermal Management"
  Kevin Moody
  Kulicke & Soffa

• "Heat Sink Modeling and Design for Dissipating High Heat"
  S. Kumaran
  Trio-Tech International Pte. Ltd.

2004s2.pdf (1.37 MB)

Session 3 -  MATERIALS SELECTION: PROPERTIES AND BEHAVIORS

Selecting materials with suitable properties and behaviors to meet a range performance, use, etc. requirements requires considerable care. Following up on last year's highly acclaimed session on materials, here is expert information to assist and guide your materials selection process.

• "Polymer Material Selection for ESD Sensitive IC Processing"
  
  Glenn A. Cunningham
  Intel Corporation

• "Dimensional Stability and High Frequency Properties of Polymeric Materials for Machined Test Sockets"
  
  Paul Kane P.E., DuPont Engineering Materials
  Joy Bloom, PhD. DuPont Experimental Station

• "Visco Elastic Behavior of Anisotropic Conductive Polymers"
  Roger Weiss, PhD., Chris Cornell, Glenn Amber
  Paricon Technologies Corporation

• "Solving Cathodic (Conductive) Anodic Filament (CAF) Migration With THERMOUNT® Laminate And Prepreg"
  Ceferino G. Gonzalez, Subhotosh Khan
  DuPont Advanced Fibers Systems

2004s3.pdf (1.37 MB)

 Tuesday, March 9, 2004

Session 4 -  MEASURING CURRENT CARRYING CAPACITY

A lack of relevant standards for measuring current carrying capacity within a socket has led our presenters to develop their own methodologies. Here are three approaches - perhaps one or more will find their way into the standards literature.

• "Study Of Current Carrying Capacity Measurement"
  Jiachun (Frank) Zhou, Uyen Nguyen, Albert Campos
  Kulicke & Soffa

• "Current Rating for Contacts, Time to Standardize the Test Method"
  
  Qifang (Michelle) Qiao, IBM Microelectronics
  Karl Schoenfeld, Gonzer Associates

• "Socket Current Carrying Capacity (CCC) Characterization"
  Victor Henckel,  Glenn A. Cunningham,  Hongfei Yan
  Intel Corporation

2004s4.pdf (387 KB)

Session 5 -  MANAGING HIGH FREQUENCY REQUIREMENTS

Socketing higher frequency devices, often in high volume, presents a host of challenging electrical and mechanical requirements to the socket/contactor engineer. This session’s presenters shared innovative studies that investigate and characterize high frequency performance.

• "Transmission Line Effects of Electroless Nickel Plating in Contactor Applications"
  Jon Diller, Kevin DeFord
  Synergetix

• "Understanding Effects of Signal Path Bandwidth On Semiconductor Test"
  
  Jason Mroczkowski
  Everett Charles Technologies

• "A Method For Contactor Characterization To 25 GHz"
  
  Tim Swettlen , Intel Corporation
  Gary Otonari,  Orlando Bell, GigaTest Labs
  Eric Bogatin, Synergetix

2004s5.pdf (2.4 MB)

Session 6 -  MODELING AND DESIGN

This is one of BiTS' most popular sessions.  Our presenters covered a range of topics relevant to today's products and processes, including factors affecting contact resistance, tooling design considerations, and stress relaxation.

• "Handling Considerations For Leadless Device Types"
  Gerhard Gschwendtberger
  Multitest Electronic Systems

• "Measurement Of Stress Relaxation In Copper Beryllium Strip Using Dynamic Techniques"
  Michael Gedeon, Jim L. Johnson
  Brush Wellman Inc.

• "Controlling Test Cell Contact Resistance With Optimized, Non-destructive Conditioning Practices"
  Jerry J. Broz, Gene Humphrey
  International Test Solutions, Inc.

• "A New Finite Element Analysis Technique For Modeling Stress Relaxation Of Electro-Mechanical Spring Contacts Made Using Copper Beryllium Strip"
  Chris M. Dempsey, Vinayak Pandey,  Intel Corporation
   Naoaki Takayama,  Enplas
  Arun Aggrawal , CAE Associates
  Jim L. Johnson, Brush Wellman Inc

2004s6.pdf (1.02 MB)

KEYNOTE SPEAKER

After dinner, our guest speaker, a renowned industry leader, spoke on a key topic to the burn-in and test socket community.

Keynote Topic:  HELPING CUSTOMERS IMPROVE THEIR PERFORMANCE RESULTS

Keynote Speaker:  David Johnson
                                         President, CEO, and Founder
                                Johnstech International Corporation

2004keynote.pdf (54.1 KB)

 Wednesday, March 10, 2004

Session 7 -  DEFORMATION AND CONTAMINATION

It's a dirty job but our group of experts have tackled it. They presented their work on the effects/impacts that deformation and contamination may have and offer some improvement methods, techniques and technologies.

• "Effects of Contaminants on Test Pad Surfaces"
  Terese Souza
  Rika Denshi America, Inc.

• "Effects Of Solder Ball Deformation On Interconnect Quality And Reliability"
  John Caldwell
  Micron Technology Inc.

• "Testing of VQFN with Palladium-Cobalt Pogo Pin"
  Thuan-Lian Chua,  Jayachandiran,  Dieter Schuetz
  Infineon Technologies

2004s7.pdf (1.3 MB)

Session 8 -  SOCKETING LEAD-FREE PACKAGES

The move to lead-free solder compositions is accelerating. In an encore to last year's session, you'll learn more about the effect of lead-free solder materials on the performance of sockets and contacts, and in turn how several contact types affect lead-free solder balls.

• "Effect of Compression Style Contactors on Lead Free Solder"
  Ila Pal
  Ironwood Electronics, Inc.

• "Pb-Free Leadframe Devices And Their Impact on Pogo Pin Socket Performance"
  Valts Treibergs
  Everett Charles Technologies

2004s8.pdf (1.31 MB)

Noon – Awards Presentation and Wrap-up

Fred Taber's closing remarks for BiTS 2004.

2004closing.pdf (353 KB)

After three days loaded with information and networking, it was now time to pack our bags and take what we've learned back to our jobs. But first, there were a few closing remarks after some recognition to the people and papers that have distinguished themselves in one way or another at BiTS 2004.