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BiTS 2003 TECHNICAL PROGRAM |
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2003panel.pdf
Panel Discussion Topic: "Reducing The Cost Of Test & Burn-in - What Are The Options?" Moderator: Fred Taber, IBM Microelectronics
Monday, March 3, 2003 Session 1: "Test and Burn-in Operations" We kicked things off in this opening session with presentations covering several techniques and methodologies to improve Test and Burn-in operations. We heard about ways to raise yield, increase productivity, lower cost and reduce lead-time.
2003s1.pdf
Session 2: "Burn-in Tools And Test Equipment" This session's presenters shared their work on tools, equipment and methods, for Burn-in systems, burn-in boards and sockets, that automate, simplify, test, measure and monitor.
2003s2.pdf
Tuesday, March 4, 2003 Session 3: "Socket And Board Development" Key development process steps include evaluating alternatives, simulating operation and performance testing. This session's presentations cover selecting and evaluating a BiB circuit design alternative, and simulating and testing socket performance.
2003s3.pdf
Session 4: "Modeling & Characterization" This session has always been one of the most popular at BiTS and this year should be no exception. With discussions relevant to today's higher power and higher pin count devices, our presenters will discuss measuring current carrying capacity, socket force models and contact resistance.
Session 5: "Thermal Management Techniques" Controlling the temperature of today's higher power devices during test and burn-in operations has led to thermal management provisions becoming an integral feature in sockets. Learn about methods and techniques to control device temperature and ways to characterize and implement them.
2003s5.pdf
Session 6: "Socketing Lead-Free Packages" The move to lead-free solder compositions is accelerating. What is the effect of lead-free solder materials on the performance of sockets and contacts? Will lead-free alloys drive development of new socket and contact technologies? Hear the results of three studies that discuss these questions.
2003s6.pdf
Keynote Topic: "IC Market Recovery Outlook" Keynote Speaker: Bill McClean, President, IC Insights 2003keynote.pdf
Wednesday, March 5, 2003 Session 7: "Contact Technology" It's the first time at BiTS for a full session focused on socket contacts. Topics covered in the presentations include plating to reduce solder adhesion, optimizing performance of fine pitch contacts and the effect of contactor geometry on high frequency performance.
2003s7.pdf
Session 8: "Properties of Socket Materials" There are many factors, and their specifications, to consider when selecting materials for test and burn-in socket bodies. In another new session at BiTS, you'll hear an array of information to assist and guide your materials selection process.
2003s8.pdf
Noon – Awards Presentation and Wrap-up Fred Taber's closing remarks for BiTS 2003. 2003closing.pdf
After three days loaded with information and networking, it was now time to pack our bags and take what we've learned back to our jobs. But first, there were a few closing remarks after some recognition to the people and papers that have distinguished themselves in one way or another at BiTS 2003.
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Page last modified 12/23/09 |
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BiTS WorkshopTM is a production of BiTS Workshop LLC | ||||||||||||||||||||
